7-Chip Laser Module with Fiber Bundle
Part Number: MCM-119
SemiNex's Multi-Chip Module family of lasers provides customers with extraordinary high power in a bundled fiber output. Laser modules are provided across the InP spectrum of 12xx to 19xx with numerous power and fiber options. Lower power and lower price versions are available in different configurations. In addition SemiNex offers high brightness modules for those applications requiring a single fiber and higher power.
Wavelength: 1560 nm
Power: 20 W CW
Aperture: 400 um
Mode: Multi Mode
Aiming beam
Photodiode
SemiNex delivers the highest available power at infrared wavelengths between 12xx and 19xx nm. When necessary we will further optimize the design of our InP laser chips to meet our customers' specific optical and electrical performance needs. Diodes, bars and packages are tested to meet customer and market performance demands. Typical results and packaging options are shown. Contact SemiNex for additional details or to discuss your specific requirements.
Applications
OEM Medical
DPSS pump source
Free Space Communications
Military / Aerospace
Thermal Processing
Features
High Power Multi Chip Laser Assembly
Fiber Bundle Assembly for low cost
High Dynamic Range
High Efficiency
Red Aiming Beam Optional
Designed for Volume Applications
Symbol Value Units Optical
Wavelength
λc
1560
nm(+/-20)
Output Power (CW)
Po
20
watts
Spectral Width
Δλ
15
nm 3dB
Emitter Width
W
400
μm
Emitter Height
H
1
μm
Temp. Coefficient
Δλ/ΔλT
0.55
nm/C
Slope Efficiency
ηo
2.1
W/A
Slow Axis Divg.
θ_parallel
12
deg FWHM
Fast Axis Divg.
θ_perp
12
deg FWHM
Number of emitters
7
Duty Cycle
DC
100
%
Electrical
Power Conversion Eff.
η
19
Min
Threshold Current
Ith
0.7
A
Operating Current
Iop
10.5
A
Operating Voltage
Vop
10.7
V
Series Resistance
Rs
0.5
ohm
Aiming Beam - Current Limit
Imax
25
mA
Aiming Beam - Operation Limit
Vop
2.2
V
Aiming Beam - Output Power
Pa
2
mW
Aiming Beam - Wavelength
λa
650
nm
Mechanical
Optical Fiber Core Dia.
375
μm
Optical Fiber NA
NA
0.22
Fiber Length
1.5
Meters
Lead Soldering Temp.
250
°C
Storage Temp.
-40 to 80
°C
Weight
585
g
Operating Temp.
-40 to 60
°C
Laser Engine Misc
LE X Axis Divergence
θ_X
12
deg FWHM
LE Y Axis Divergence
θ_Y
12
deg FWHM
Other
Specified values are rated at a constant heat sink temperature of 20oC.
商品属性 [波长] 1560nm [功率] 20W CW