High Performance Cooled CCD Camera System
System Features*1
• High Resolution Sensors
8.3 Megapixel sensor with 5.4 μm pixels delivers a large
field of view with high resolution.
• Programmable TE cooling down to 50oC below ambient
Ideal for detection of weak chemiluminescence or astronomy
images, enabling long exposure acquisitions with optimised
signal to noise ratio.
• USB 2.0 interface
Direct ‘Plug and Play’ simplicity of USB 2.0.
• 16-Bit digitization
High photometric accuracy.
• High longevity shutter
Shutter during readout and take dark reference frames - 43 mm.
• Programmable I/O port
Synchronization with intricate experimental set-ups.
• Remote Triggering
LVTTL input allows exposure to start within 25 microseconds
of the rising edge of the trigger.
• Focusing mode
Faster readout option, ideal for focus optimisation.
• Andor OEM optimisation
Compact and robust, Andor integration support, Andor quality
enhancement, Andor post-sale support. Now also supported
by ‘Andor SDK’
Apogee Alta F8300: Compact, 8.3 Megapixel CCD
Ideal for OEM and astronomy applications, the Apogee Alta family has been a mainstay of high end imaging for many years, offering a wide range of full frame and interline CCDs. A USB 2.0 interface offers the convenience of simple, robust connection to PC.
The Alta F8300 uses a medium format 8.3 megapixel sensor, ideal for applications requiring a large field of view with a smaller pixel size. Anti-blooming structures to prevent image corruption under high light conditions. Cooling down to 50oC below ambient results in a low dark current contribution.
Specifications Summary*1
Array Size (pixels)
3326 x 2504 (8.3 Megapixel)
Pixel Size
5.4 x 5.4μm
Sensor Size
18 x 13.5 mm (243 mm2)
22.5 mm diagonal
Pixel Well Depth (typical)
40,000 e-
Dark Current*2
0.016 e-/pixel/sec
Read Noise*3
9.9 e- (RMS @ 0.83 MHz)
Maximum Dynamic Range
72.1 dB (5839:1)
Quantum Efficiency
30% @550nm
60% @400nm
Technical Specifications*1
Sensor Type KAF-8300 (ON Semiconductor)
Active pixels
3326 x 2504 W x H (8.3 Megapixel)
Sensor Size
18 x 13.5 mm (243 mm2)
22.5 mm diagonal
Pixel Size
5.4 x 5.4 μm
Pixel Well Depth
40,000 e-
Read Noise*3
9.9 e- (RMS @0.83 Mhz)
Pixel Binning
1 x 1 to 8 x 2504 on chip
Quantum Efficiency*4
30% @550nm, 60% @400nm
Cooling
Maximum cooling up to 50°C below ambient temperature; -25°C at 25°C ambient Thermoelectric cooler with forced air.
Temperature Stability
+/- 0.1oC
Dark Current*3
0.016 e-/pixel/sec
Blemish Specification
Grade S as per sensor manufacturer definition
Anti-blooming factor
>100x
Maximum Dynamic Range
75.3 dB (5839:1)
Linearity
Better than 99%
Frame Rate (fps)*5
0.10 Full frame (@0.83 MHz)
0.80 Full frame (@6.7 MHz, focusing mode)
Frame Sizes
Full frame, sub-frame
Digital Resolution
16-bit
Camera Window
UV-grade fused silica
General Specifications
Interface Options
USB 2.0
Remote Triggering
LVTTL trigger input, expose strobe output
Peripheral communications
8 pin mini-DIN I/O connector
Image Sequencing
1 to 65535 image sequences under software control
Exposure Time
95 minutes (max)
(1.33 microsecond increments)
Mechanical Specifications
Camera Housing
Aluminum, hard anodized (D02)
Camera Head Size
6”x6”x2.5” (15x15x6.35 cm)
Back Focal Distance
1.025” (2.60 cm) [optical]
Mounting
3.5” bolt circle. 2” 24 TPI thread. Optional Nikon F-mount or Canon FD or EF/EOS mount.
Shutter
43 mm shutter.
Weight
3.1 lb. (1.4 kg)
商品属性 [Active pixels ] 3326 x 2504 (8.3 Megapixel) [Pixel Size] 5.4 x 5.4 μm [Image area] 18 x 13.5 mm