PIXIS-XO Soft X-Ray Cameras
The PIXIS-XO series of fully integrated imaging cameras utilizes back-illuminated (BI) CCDs without AR coating, for direct detection of the widest range of X-rays between ~ 10 eV and 30 keV (AR coated devices are not useful for X-ray energies < 500eV). With a 2048 x 2048 imaging array, 13.5 µm pixels, 100% fill factor, low noise electronics and-50° C to -70° C thermoelectric cooling with either air or water, this system is ideal for worry-free operation in research and OEM environments. The rotatable conflat flange with high-vacuum-seal design, software selectable gains and readout speeds make these cameras well suited for ultra-high vacuum applications.
FEATURES
BENEFITS
Back-illuminated CCD, with no AR coating
Provides very low X-ray flux imaging, high sensitivity and high spatial resolution
2 Mhz / 16-bit readout
100 kHz / 16-bit readout
High speed readout for rapid image acquisition; Slow speed readout for high sensitivity
with wide dynamic range, high signal-to-noise ratio (SNR) and excellent energy resolution
Software selectable gains for each digitization speed
Allows optimization of system performance for lowest noise to highest SNR
2048 x 2048 image area,
13.5 x 13.5 µm pixels
Wide field of view, highest resolution with 13.5 µm pixel
Ultra low noise electronics
Best possible system performance
Flexible user-selectable binning & readout
Total flexibility to optimize experiments and SNR
Kinetics
Custom readout mode offers microsecond resolution
Deep thermoelectric air cooling
Maintenance-free operation - No need for a liquid circulator or additional power supply
Deep thermoelectric water cooling
Vibration-free operation
Conflat vacuum interface
Industry-standard, high-vacuum compatibility
TTL input and output
External Trigger input with programmable polarity;
TTL output with exposure or readout monitor
USB 2.0 interface
Seamless, plug-and-play connection to PC notebooks & desktops; Easy OEM integration
WinView/Spec software (for Windows XP/7; 32-bit)
or LightField™ (for Windows 7; 64-bit)
Powerful, yet easy-to-use software packages for acquisition, display and analysis;
Powerful yet intuitive interface; Direct stream to hard drive
Optional: LightField® (for Windows 8/7, 64-bit)
Flexible software packages for data acquisition, display and analysis with built in math
engine; LightField offers intuitive, cutting edge user interface and more.
PICAM (64-bit)
software development kits (SDKs)
Compatible with Windows 8/7/XP, and Linux;
Universal programming interfaces for easy custom programming.
LabVIEW® and MATLAB
Easy integration of camera into complex experiments.
Applications:X-ray Imaging, X-ray Microscopy, EUV Lithography and X-ray Plasma Diagnostics
SPECIFICATIONS
PIXIS-XO: 2048B
PIXIS-XO: 2048BUV/BR*
CCD Image Sensor
e2v CCD42-40; scientific grade 1; MPP;
BI-basic process (B); no AR coating;
for sensitivity between ~10 eV to 30 keV
e2v CCD42-40; scientific grade 1; NIMO;
BI-enhanced process (BUV), BI-deep depletion (BR);
no AR coating; for sensitivity between
~10 eV to 30 keV
Dark current @ -60° C
(with ambient air @ +20° C)
0.002 e-/p/sec (typical)
0.006 e-/p/sec (max)
0.2 e-/p/sec (typical)
2 e-/p/sec (max)
CCD format
2048 x 2048 imaging pixels; 13.5 x 13.5 mm pixels; 100% fill factor; 27.6 x 27.6 mm (optically centered)
Deepest cooling temperature,
-70° C (typical); -60° C (guaranteed) with CoolCUBE II liquid circulator
TE air cooling**
(with ambient air @ +20° C)
-60° C (typical); -50° C (guaranteed) with air
Thermostating precision
±0.05° C
Cooling method
Thermoelectric air or liquid cooling (CoolCUBE II required)
Full well
Single pixel:100 ke- (typical), 80 ke- (minimum)
High Sensitivity node: 250 ke- (typical), 220 ke- (minimum)
High Capacity node: 1000 ke- (typical), 800 ke- (minimum)
ADC speed/bits
100 kHz/16-bit and 2 MHz/16-bit
System read noise @100 kHz
@2 MHz
3.5 e- rms (typical),5 e- rms (max)
12 e- rms (typical), 16 e- rms (max)
Vertical shift speed
32.2 msec/row (programmable)
Non-linearity
<2% @ 100 kHz
Software selectable gains
1, 2, 4 e-/ADU (low noise input); 3.5, 7, 14 e-/ADU (high capacity output)
Operating systems supported
Windows XP/Vista/7; Linux
Data interface
USB2.0 (5m interface cable provided); Optional Fiberoptic interface is available for remote operation
I/O signals
Two MCX connectors for programmable frame readout, shutter, trigger in
Operating environment
+5° C to +30° C non-condensing
Bakeout temperature
70° C (maximum)
Vacuum Compatibility
10 -8 Torr
Certification
CE
Dimensions / Weight
15.1 cm (5.95“) x 15.24 cm (6.00“) x 15.24 cm (6.00“) (L x W x H) / 3.86 kg (8.5 lbs)†
NOTES: All specifications subject to change
* Contact your local sales representative for information on the availability of the BUV / BR model.
* The minimum temperature attainable is dependent on the vacuum condition - temperature can be lowered w/lower vacuum.
† The weight of the camera is with 6.00“ Conflat flange and air cooling.
Readout Rates
Binning
@ 2 MHz
@100 kHz
1 x 1
2.265 sec
36.45 sec
2 x 2
0.956 sec
9.521 sec
4 x 4
0.458 sec
2.595 sec
8 x 8
0.249 sec
0.738 sec
16 x 16
0.154 sec
0.288 sec
Quantum Efficiency Curves
OUTLINE DRAWING
6" Conflat
商品属性 [CCD Image Sensor] e2v CCD42-40; scientific grade 1; MPP; BI-basic process (B); no AR coating; for sensitivity between ~10 eV to 30 keV [CCD format] 2048 x 2048 imaging pixels; 13.5 x 13.5 mm pixels; 100% fill factor; [Dark current] 0.002 e-/p/sec (typical) 0.006 e-/p/sec (max) [Imaging area] 27.6 x 27.6 mm (optically centered)