EOTPR 2000 Rapid Fault Isolation in Complex Packages
Product Description
The EOTPR 2000 is used to identify and quickly isolate faults on the interconnects of advanced packages.
The injected pulse reflects off faults within DUT locating their position with accuracy of 5 μm.
Applications include:
Flip Chip.
Package-on-Package (PoP).
Through-Silicon Vias (TSV).
Product Features
Quick non-destructive fault isolation – minutes rather than days.
Identification of weak connections that may lead to future faults.
Ability to isolate faults not previously seen with conventional TDR.
TeraView EOTPR 2000
Terahertz based advanced non-destructive fault isolation
EOTPR Capabilities
EOTPR pulse rise time 6 ps (based on processed data) Defined as the time for the reflected impulse from the end
of the high frequency probe to rise from 10% to 90% of its maximum value
Accuracy Able to locate a feature on 50 Ω coplanar waveguide positioned close to the high frequency
probe with precision of ± 5 µm
Range Up to 200 mm from contact with probe in a typical package Input Impedance 50 Ω nominal Signal to noise 94 dB
Case Study 1 — Interconnect Integrity in Advanced Integrated Circuit Package
Device A and B both have a FIB cut in an identical trace.
The position of the cut is separated by 89 μm in the devices (measured from BGA to start of the FIB cut).
EOTPR can clearly identify the difference in location of the open circuit in the two devices.
Case Study 2 — Interconnect Integrity in Advanced Integrated Circuit Package
THz EOTPR allows operator to quickly locate the fault.
Differentiation and fault location with THz EOTPR – line difference
gives fault location.
Fault location confirmed by X-ray analysis.
*Data from Intel paper, ECTC Proc. 2010