Ultrafast Platform for Nanosecond Time-resolved Imaging and Spectroscopy
Key Specifications
• 5.5 megapixel sCMOS
• 50 fps full frame
• High dynamic range at full speed
• Integrated triple output DDG
• Photocathode QE up to 50%
• Integrate-On-Chip gating up to 500 kHz
• USB 3.0 interface
Key Applications
Plasma studies
Time-resolved Fluorescence / Photoluminescence
Flow analysis / Combustion / PLIF imaging
Hyperspectral imaging
On-head spectroscopy and multi-track modes
iStar sCMOS – Ultrafast acquisition speeds
Flow Analysis / Combustion
iStar sCMOS comfortably accommodates the 15 Hz imaging requirement of typical PLIF setups with extremely low noise floor and excellent dynamic range, nanosecond snapshots of the flame and high background light rejection. Optical inter-frame down to 200 ns for time-gated PIV setups with a wide range of velocities.
Plasma Imaging
The high frame rate and < 2 ns gating of the iStar sCMOS allow faster reconstruction of plasma dynamics with extremely high temporal resolution.
Hyperspectral Imaging & multitrack spectroscopy
On-head FPGA functions can discriminate up to 256 individual channels (e.g. multi-leg fibre optic) with no acquisition rate sacrifice compared to CCDs. Takes great advantage of Andor’s spectrograph portfolio imaging portfolio e.g. Andor Holospec.
GPU Express for real time data processing.
Features & Benefits
Features
Benefits
50 frames/s acquisition rates
Sustainable rate at full field-of-view, out-performs CCD and interline-based ns gated ICCDs
with equivalent field-of-view.
16.6 x 14.0 mm sensor matrix
Large field of view, access more of the useful active area of Ø18 mm image intensifiers
without the need for optical tapers.
2.4 e- read noise
Highest dynamic range even at the fastest frame rates, up to 5 times better performance
than the closest interline-based competitor
12-bit and 16-bit modes
12-bit mode for smaller file size and absolute fastest frame rates, 16-bit for full dynamic range.
Up to 32-bit data transmission to PC
On-head intelligence to preserve dynamic range in extensive pixel binning, or high intensity
pixel binning scenarios.
Optical inter-frame down to 300 ns
Ideal for PIV-type applications requiring fast dual images snapshots with high background
rejection or supersonic flow analysis. The true Global Shutter mode facilitates an optical
inter-frame gap down to 100 ns, although the intensifier phosphor decay time is the limiting
factor. The decay time of a fast P46 phosphor is typically 200 ns (@ 10% intensity).
TE cooling down to 0oC
Efficiently minimizes dark current noise for acquisitions requiring longer sensor exposure
time, e.g. integrate-on-chip mode.
High QE Gen 2 & 3 image intensifiers
Superior photon capture, with peak QE up to 50% and spectral coverage from 120 to 1,100 nm.
True optical gating < 2 ns
Billionth of a second time-resolution for accurate transient phenomena study.
Low jitter, on-board Digital Delay Generator
(DDGTM )
Highest gating timing accuracy with lowest propagation delay. Software controlled 3x triggering
outputs with 10 ps setup accuracy for complex experiment integration.
500 kHz sustained photocathode gating
(3.3 MHz Burst Mode)
Maximizes signal-to-noise ratio in high repetition rate pulse laser-based applications. Burst mode
allows gate pulse separation down to 300 ns for time-resolved PIV mode.
Photocathode EBI minimization
Dry gas purge interface for further efficient EBI reduction.
IntelligateTM
Intelligent and accurate MCP gating for better than 1:108 shuttering efficiency in the UV (Gen 2
image intensifier).
USB 3.0 interface
Super-fast data transfer at 40 fps full frame with a plug-and-play, user-friendly interface – optical
extenders available for operation up to 100 m.
GPU Express
Simplify and optimize data transfers from camera to Graphical Processing Unit (GPU) card to
facilitate accelerated GPU processing as part of the acquisition pipeline.
Integrated in EPICS
Ease of operation in EPICS software-based facilities such as partner particle accelerators
and other large scientific experiments.
2 year warranty
Reliability and guaranteed performance over time.
Spectroscopy Modes
On-head asymmetric
binning and multi-track
On-board intelligence delivering Spectroscopists-friendly spectra and multi-track data prior to transfer
through 10-tap or USB interface. Upfront data size reduction and easier user data processing.
Selectable bit-depth
up to 32-bit
Preserve dynamic range in extensive on-head binning scenarios. User-selectable data bit depth to
be transmitted over the camera interface, up to 32-bit.
Technical Specifications*2
Sensor type
Front-Illuminated Scientific CMOS
Sensor matrix
2560 x 2160 pixels (W x H), 6.5 µm pixel size
Sensor size
16.6 x 14.0 mm 21.8 mm diagonal
Pixel well depth (e- )
30,000
Read noise (e- ) median [rms]
at available pixel readout rates*3
@ 200 MHz 2.3 [2.5]
@ 560 MHz 2.4 [2.6]
Minimum cooling temperature*4
[dark current, e- /pixel/s]
air cooled
liquid cooled
Ø18 mm photocathode
0℃[0.18]
0℃ [0.18]
Ø25 mm photocathode
0℃[0.18]
0℃ [0.18]
Sensor linearity (% maximum)*5
Better than 99.8%
Data range
12-bit (fastest speed) and 16-bit (maximum dynamic range)
Pixel binning
On-head, pre-defined options 2x2, 4x4 … or flexible configuration setup
Region of Interest
Minimum channel height of 8 rows
Interface option
USB 3.0
Internal memory
1GB
Camera and Internal Digital Delay Generator (DDG) Inputs/Outputs
Gate pulse delay & width
Adjustable from 0 ns to 10 s in 10 ps steps
Trigger Outputs
Output A, B and C
+5V CMOS level with 50 Ω source impedance; can drive 5V into a non-terminating load or 2.5V into 50 Ω load;
output synchronized triggers for auxiliary equipment, e.g. lasers, flash lamps, National Instrument™ hardware
Individual delays control from 0 ns to 10 s in 10 ps steps Configurable Polarity
Fire
5V CMOS level reference signal for beginning and end of individual sensor exposure
Arm monitor
5V CMOS level reference signal to indicate when system is ready to accept external triggers. Signal goes high
when system is ready to accept external triggers (after a readout has finished or sooner if in overlap mode)
and goes low when the exposure is finished
Gate & output A, B and C jitter
35 ps rms (relative to external trigger or to each other)
Trigger Inputs
External trigger
Trigger input for sensor and Digital Delay Generator Up to 500 kHz for Integrate-On-Chip mode
Direct gate
TTL input for exact external control of photocathode width and timing with smallest insertion delay
Additional Controls
Gate monitoring
AC coupling from photocathode to monitor exact photocathode on/off switching and timings
Insertion delay
< 19 ns in direct gate operation
商品属性 [Active pixels ] 2560 x 2160 [Pixel Size] 6.5 µm [Frame Rate] 50 fps