High Performance Cooled CCD Camera System
System Features*1
• High Resolution Sensor
1.9 Megapixel sensor with 7.4 μm pixels delivers an large field
of view with high resolution.
• Programmable TE cooling down to 45oC below ambient
Ideal for detection of weak chemiluminescence or astronomy
images, enabling long exposure acquisitions with optimized
signal to noise ratio.
• USB 2.0 interface
Direct ‘Plug and Play’ simplicity of USB 2.0.
• 16-Bit digitization
High photometric accuracy.
• High longevity shutter
Shutter during readout and take dark reference frames - 25 mm.
• Programmable I/O port
Synchronization with intricate experimental set-ups.
• Remote Triggering
LVTTL input allows exposure to start within 25 microseconds of
the rising edge of the trigger.
• Focusing mode
Faster readout option, ideal for focus optimisation.
• Andor OEM optimisation
Compact and robust, Andor integration support, Andor quality
enhancement, Andor post-sale support. Now also supported
by ‘Andor SDK’
Apogee Alta F2000: Compact, 1.9 Megapixel CCD
Ideal for OEM and astronomy applications, the Apogee Alta family has been a mainstay of high end imaging for many years, offering a wide range of full frame and interline CCDs. A USB 2.0 interface offers the convenience of simple, robust connection to PC.
The Alta F2000 has a 1.9 megapixel interline transfer sensor with a high quantum efficiency and twice the dynamic range of similar Sony sensors. Cooling down to 45°C below ambient results in a low dark current contribution. When combined with its low noise and small pixels, the Alta F2000 makes an ideal solution for OEM applications, biological and physical sciences.
Specifications Summary*1
Array Size (pixels)
1600 x 1200 (1.9 Megapixel)
Pixel Size
7.4 x 7.4 μm
Sensor Size
11.8 x 8.9 mm (105.1 mm2)
14.8 mm diagonal
Pixel Well Depth (typical)
31,000 e-
Dark Current*2
0.0113 e-/pixel/sec
Read Noise*3
7.4 e- (RMS @0.91 MHz)
Maximum Dynamic Range
72.4 dB (4189:1)
Quantum Efficiency
56% @480nm
47% @400nm
Technical Specifications*1
Sensor Type
KAI-2020 (ON Semiconductor)
Active pixels
1600 x 1200 W x H (1.9 Megapixel)
Sensor Size
11.8 x 8.9 mm (105.1 mm2)
14.8 mm diagonal
Pixel Size
7.4 x 7.4 μm
Pixel Well Depth
31,000 e-
Read Noise*3
7.4 e- (RMS @0.91 MHz)
Pixel Binning
1 x 1 to 8 x 1200 on chip
Quantum Efficiency*4
56% @480nm
47% @400nm
Cooling
Maximum cooling up to 45°C below ambient temperature; -20°C at 25°C ambient Thermoelectric cooler with forced air.
Temperature Stability
+/- 0.1oC
Dark Current
0.0113 e-/pixel/sec
Blemish Specification
Grade S as per sensor manufacturer definition
Anti-blooming factor
300x
Maximum Dynamic Range
72.4 dB (4189:1)
Linearity
Better than 99%
Frame Rate (fps)*
0.45 Full frame (@ 0.91 MHz)
2.52 Full frame (@6.53 MHz, focusing mode)
Frame Sizes
Full frame, sub-frame
Digital Resolution
16-bit
Camera Window
UV-grade fused silica
General Specifications
Interface Options
USB 2.0
Remote Triggering
LVTTL trigger input, expose strobe output
Peripheral
communications
8 pin mini-DIN I/O connector
Image Sequencing
1 to 65535 image sequences under software control
Exposure Time
95 minutes (max)(1.33 microsecond increments)
Mechanical Specifications
Camera Housing
Aluminum, hard anodized (D01)
Camera Head Size
6”x 6”x 2.5” (15x15x6.25 cm)
Back Focal Distance
0.69” (1.75cm) [optical]
Mounting
3.5” bolt circle.
C-mount (1” 32 TPI thread).
Optional Nikon F-mount or Canon FD.
Shutter
25 mm shutter.
Weight
3.1 lb. (1.4 kg)
商品属性 [Active pixels ] 1600 x 1200 (1.9 Megapixel) [Pixel Size] 7.4 x 7.4 μm [Image area] 11.8 x 8.9 mm